The Washington Group Announces Summer Internship Program for Ukrainians in the United States

The Washington Group (TWG), in cooperation with the Embassy of Ukraine in the United States, has opened a call for applications for a summer internship in 2025 at the diplomatic mission in Washington, DC. TWG, an association of Ukrainian-American professionals, will provide a scholarship for an intern to work at the Embassy.

This was reported by The Washington Group.

Internship conditions

TWG provides a stipend of $3000 to cover the costs of the eight-week internship. 

Applicants must be citizens of Ukraine who are international students enrolled at a U.S. university or who are legal residents of the United States.

The intern will work under the supervision of an Embassy staff member and will perform the following tasks:

  • Attending events related to Ukraine and preparing analytical materials
  • Research, writing and translation
  • Organizing events and meetings at the Embassy or the Ukrainian House
  • Execution of administrative tasks

Requirements for candidates

Candidates must be fluent in Ukrainian and English.

To participate, you must submit:

  • One-page resume (CV) with education, work experience and volunteer activities
  • An essay (up to 1000 words) describing your interest in Ukraine, Ukrainian-American relations, expectations of the internship, and your reasons for participating in the program

Documents in English should be pasted directly into the body of the email and sent to InternshipTWG@gmail.com. Attachments will not be accepted.

The application deadline is March 8, 2025.

Selection process

Applications will be reviewed by the TWG Fellowship Fund Committee. The best candidates will be recommended to the Embassy of Ukraine, which will make the final decision after an interview and written assignments.

TWG and the Embassy of Ukraine also draw attention to the fact that they do not cover additional expenses beyond the scholarship provided.

For more information about The Washington Group Fellowship, please contact here

Author: Danylo Pievchev

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